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MC33263
Ultra Low Noise 150 mA Low Dropout Voltage Regulator with ON/OFF Control Housed in a SOT23-L package, the MC33263 delivers up to 150 mA where it exhibits a typical 180 mV dropout. With an incredible noise level of 25 mVRMS (over 100 Hz to 100 kHz, with a 10 nF bypass capacitor), the MC33263 represents the ideal choice for sensitive circuits, especially in portable applications where noise performance and space are premium. The MC33263 also excels in response time and reacts in less than 25 ms when receiving an OFF to ON signal (with no bypass capacitor). Thanks to a novel concept, the MC33263 accepts output capacitors without any restrictions regarding their Equivalent Series Resistance (ESR) thus offering an obvious versatility for immediate implementation. With a typical DC ripple rejection better than -90 dB (-70 dB @ 1 kHz), it naturally shields the downstream electronics against choppy power lines. Additionally, thermal shutdown and short-circuit protection provide the final product with a high degree of ruggedness.
Features:
http://onsemi.com MARKING DIAGRAMS
6 SOT-23L NW SUFFIX CASE 318J 1 x = Voltage Option Code A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week xAYLW
6 1
* Very Low Quiescent Current 170 A (ON, no load), 100 nA (OFF, * Very Low Dropout Voltage, typical value is 137 mV at an output * Very Low Noise with external bypass capacitor (10 nF), * * * * * * * * *
current of 100 mA typically 25 Vrms over 100 Hz to 100 kHz Internal Thermal Shutdown Extremely Tight Line Regulation typically -90 dB Ripple Rejection -70 dB @ 1 kHz Line Transient Response: 1 mV for DVin = 3 V Extremely Tight Load Regulation, typically 20 mV at DIout = 150 mA Multiple Output Voltages Available Logic Level ON/OFF Control (TTL-CMOS Compatible) ESR can vary from 0 to 3W Functionally and Pin Compatible with TK112xxA/B Series Telephones, Radio Control Systems, Toys and Low Voltage Systems
MC33263 Block Diagram
6 Input Shutdown 1 ON/OFF Thermal Shutdown 4 Output
PIN CONNECTIONS
ON/OFF 1 GND 2 BYPASS 3 (Top View) 6 VIN 5 GND 4 VOUT
no load)
ORDERING INFORMATION
Device MC33263NW-28R2 MC33263NW-30R2 MC33263NW-32R2 MC33263NW-33R2 MC33263NW-38R2 MC33263NW-40R2 MC33263NW-47R2 MC33263NW-50R2 Version 2.8 V 3.0 V 3.2 V 3.3 V 3.8 V 4.0 V 4.75 V 5.0 V Shipping 2500 Tape & Reel 2500 Tape & Reel 2500 Tape & Reel 2500 Tape & Reel 2500 Tape & Reel 2500 Tape & Reel 2500 Tape & Reel 2500 Tape & Reel
Applications:
* All Portable Systems, Battery Powered Systems, Cellular
3 Bypass
Band Gap Reference
All Devices Available in SOT-23L 6 Lead Package
2 GND
* Current Limit * Antisaturation * Protection
5
GND
(c) Semiconductor Components Industries, LLC, 2000
1
April, 2000 - Rev. 2
Publication Order Number: MC33263/D
MC33263
DEVICE MARKING
XALYW 1st Digit Marking A B Version 2.8 V 3.0 V 3.2 V 3.3 V 3.8 V 4.0 V
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C D E F G H A L 4.75 V 5.0 V 2nd Digit 3rd Digit Location Code Wafer Lot Traceability Date Code 4th/5th Digits YW
6 Pin 1 Ink Mark Identifier or Solid Pin 1 Dot or Dimple 1
5
4
XALYW
2 SOT-23L
3
MAXIMUM RATINGS
Rating
Symbol Vin PD
Pin # 6
Value 12
Unit V
Power Supply Voltage
Power Dissipation and Thermal Resistance Maximum Power Dissipation NW Suffix, Plastic Package Thermal Resistance, Junction-to-Air Thermal Resistance, Junction-to-Case Operating Ambient Temperature Maximum Junction Temperature Storage Temperature Range
RqJA RqJC
Internally Limited 210
W
C/W C/W C C C
TA TJmax Tstg
-40 to +85 150
-60 to +150
ELECTRICAL CHARACTERISTICS (For typical values TA = 25C, for min/max values TA = -40C to +85C, Max TJ = 150C)
Characteristics Symbol Pin # Min Typ Max
Unit
CONTROL ELECTRICAL CHARACTERISTICS
Input Voltage Range VON/OFF ION/OFF 1 1 1 0 - - Vin - V ON/OFF Input Current (All versions) VON/OFF = 2.4 V
mA
V
2.5 - -
ON/OFF Input Voltages (All versions) Logic "0", i.e. OFF State Logic "1", i.e. ON State
VON/OFF
- 2.2
0.3 -
CURRENTS PARAMETERS
Current Consumption in OFF State (All versions) OFF Mode Current: Vin = Vout + 1.0 V, Iout = 0 mA
IQOFF IQON
mA mA mA
- - -
0.1
2.0
Current Consumption in ON State (All versions) ON Mode Sat Current: Vin = Vout + 1.0 V, Iout = 0 mA
170 900 210
200
Current Consumption in Saturation ON State (All versions) ON Mode Sat Current: Vin = Vout - 0.5 V, Iout = 0 mA Current Limit Vin = Vout + 1.0 V, (All versions) Output Short-circuited (Note 1.)
IQSAT IMAX
1400 -
mA
175
1. Iout (Output Current) is the measured current when the output voltage drops below 0.3 V with respect to Vout at Iout = 30 mA.
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ELECTRICAL CHARACTERISTICS (For typical values TA = 25C, for min/max values TA = -40C to +85C, Max TJ = 150C)
Characteristics Vin = Vout + 1.0 V, TA = 25C, 1.0 mA < Iout < 150 mA 2.8 Suffix 3.0 Suffix 3.2 Suffix 3.3 Suffix 3.8 Suffix 4.0 Suffix 4.75 Suffix 5.0 Suffix Vin = Vout + 1.0 V, -40C < TA < 80C, 1.0 mA < Iout < 150 mA 2.8 Suffix 3.0 Suffix 3.2 Suffix 3.3 Suffix 3.8 Suffix 4.0 Suffix 4.75 Suffix 5.0 Suffix Symbol Vout Pin # 4 Min 2.74 2.94 3.13 3.23 3.72 3.92 4.66 4.90 Typ 2.8 3.0 3.2 3.3 3.8 4.0 4.75 5.0 Max 2.86 3.06 3.27 3.37 3.88 4.08 4.85 5.1 Unit V
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Vout 4 2.7 2.9 3.09 3.18 3.67 3.86 4.58 4.83 2.8 3.0 3.2 3.3 3.8 4.0 4.75 5.0 2.9 3.1 3.31 3.42 3.93 4.14 4.92 5.17 V
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LINE AND LOAD REGULATION, DROPOUT VOLTAGES
Line Regulation (All versions) Vout + 1.0 V < Vin < 12 V, Iout = 60 mA Load Regulation (All versions) Regline 4/6 1 mV mV - - - - - - - 2.0 8.0 15 20 10 25 35 45 Vin = Vout + 1.0 V Iout = 1.0 to 60 mA Iout = 1.0 to 100 mA Iout = 1.0 to 150 mA Iout = 10 mA Iout = 100 mA Iout = 150 mA Regload Dropout Voltage (All versions) Vin - Vout 4, 6 mV 30 137 180 90 230 260
DYNAMIC PARAMETERS
Ripple Rejection (All versions) Vin = Vout + 1.0 V, Vpp = 1.0 V, f = 1.0 kHz, Iout = 60 mA Line Transient Response Vin = Vout + 1.0 V to Vout + 4.0 V, Iout = 60 mA, d(Vin)/dt = 15 mV/ms
4, 6 4, 6
dB
60 -
70
- -
mV
1.0
Output Noise Voltage (All versions) Cout = 1.0 F, Iout = 60 mA, f = 100 Hz to 100 kHz Cbypass = 10 nF Cbypass = 1.0 nF Cbypass = 0 nF Output Noise Density Cout = 1.0 F, Iout = 60 mA, f = 1.0 kHz
VRMS
4, 6
Vrms
- - - -
25 40 65
- - - -
VN tr
4 4
nV/ Hz
230
Output Rise Time (All versions) Cout = 1.0 F, Iout = 30 mA, VON/OFF = 0 to 2.4 V 1% of ON/OFF Signal to 99% of Nominal Output Voltage Without Bypass Capacitor With Cbypass = 10 nF
- -
40 1.1
- -
s ms
AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA A A A AA A AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA A A A AA A
Thermal Shutdown (All versions) - 150 - C
THERMAL SHUTDOWN
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MC33263
DEFINITIONS Load Regulation - The change in output voltage for a change in load current at constant chip temperature. Dropout Voltage - The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100 mV below its nominal value (which is measured at 1.0 V differential), dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Output Noise Voltage - The RMS AC voltage at the output with a constant load and no input ripple, measured over a specified frequency range. Maximum Power Dissipation - The maximum total dissipation for which the regulator will operate within specifications. Quiescent Current - Current which is used to operate the regulator chip and is not delivered to the load. Line Regulation - The change in input voltage for a change in the input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Line Transient Response - Typical over- and undershoot response when input voltage is excited with a given slope. Thermal Protection - Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated, typically 150C, the regulator turns off. This feature is provided to prevent catastrophic failures from accidental overheating. Maximum Package Power Dissipation - The maximum package power dissipation is the power dissipation level at which the junction temperature reaches its maximum value i.e. 125C. The junction temperature is rising while the difference between the input power (VCC X ICC) and the output power (Vout X Iout) is increasing. Depending on ambient temperature, it is possible to calculate the maximum power dissipation, maximum load current or maximum input voltage (see Application Hints: Protection). The maximum power dissipation supported by the device is a lot increased when using appropriate application design. Mounting pad configuration on the PCB, the board material and also the ambient temperature are affected the rate of temperature rise. It means that when the IC has good thermal conductivity through PCB, the junction temperature will be "low" even if the power dissipation is great. The thermal resistance of the whole circuit can be evaluated by deliberately activating the thermal shutdown of the circuit (by increasing the output current or raising the input voltage for example). Then you can calculate the power dissipation by subtracting the output power from the input power. All variables are then well known: power dissipation, thermal shutdown temperature (150C for MC33263) and ambient temperature.
APPLICATION HINTS Input Decoupling - As with any regulator, it is necessary to reduce the dynamic impedance of the supply rail that feeds the component. A 1 mF capacitor either ceramic or tantalum is recommended and should be connected close to the MC33263 package. Higher values will correspondingly improve the overall line transient response. Output Decoupling - Thanks to a novel concept, the MC33263 is a stable component and does not require any Equivalent Series Resistance (ESR) neither a minimum output current. Capacitors exhibiting ESRs ranging from a few mW up to 3W can thus safely be used. The minimum decoupling value is 1 mF and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum devices. Noise Performances - Unlike other LDOs, the MC33263 is a true low-noise regulator. With a 10 nF bypass capacitor, it typically reaches the incredible level of 25 mVRMS overall noise between 100 Hz and 100 kHz. To give maximum insight on noise specifications, ON Semiconductor includes spectral density graphics as well as noise dependency versus bypass capacitor. The bypass capacitor impacts the start-up phase of the MC33263 as depicted by the data-sheet curves. A typical 1 ms settling time is achieved with a 10 nF bypass capacitor. However, thanks to its low-noise architecture, the MC33263 can operate without bypass and thus offers a typical 20 ms start-up phase. In that case, the typical output noise stays lower than 65 mVRMS between 100 Hz - 100 kHz. Protections - The MC33263 hosts several protections, conferring natural ruggedness and reliability to the products implementing the component. The output current is internally limited to a minimum of 175 mA while temperature shutdown occurs if the die heats up beyond 150C. These value lets you assess the maximum differential voltage the device can sustain at a given output current before its protections come into play. The maximum dissipation the package can handle is given by:
P max
+ TJmax - TA R
qJA
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MC33263
If TJmax is internally limited to 150C, then the MC33263 can dissipate up to 595 mW @ 25C. The power dissipated by the MC33263 can be calculated from the following formula:
Ptot
+
V in
@ Ignd(Iout) ) Vin * Vout @ Iout
gnd out
or
Vin max
out + PtotI ) V) I @ Iout
If a 150 mA output current is needed, the ground current is extracted from the data-sheet curves: 6.5 mA @ 150 mA. For a MC33263NW28R2 (2.8 V), the maximum input voltage will then be 6.48 V, a rather comfortable margin. Typical Application - The following figure portraits the typical application for the MC33263 where both input/output decoupling capacitors appear.
Figure 2. Printed Circuit Board
Input
Output
Differential (Vin-Vout)
6 C3 1.0 mF 1 On/Off
5
4 C2 1.0 mF Input 3 C1 10 nF Rpull-up C1
MC33263
C3 +
MC33263 + C2
Output
2
Figure 1. A Typical MC33263 Application with Recommended Capacitor Values
ON/OFF
As for any low noise designs, particular care has to be taken when tackling Printed Circuit Board (PCB) layout. The following figure gives an example of a layout where stray inductances/capacitances are minimized.
Figure 3. Copper Side Component Layout
This layout is the basis for an MC33263 performance evaluation board where the BNC connectors give the user an easy and quick evaluation mean.
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MC33263
MC33263 Wake-up Improvement - In portable applications, an immediate response to an enable signal is vital. If noise is not of concern, the MC33263 without a bypass capacitor settles in nearly 20 ms and typically delivers 65 mVRMS between 100 Hz and 100 kHz. In ultra low-noise systems, the designer needs a 10 nF bypass capacitor to decrease the noise down to 25 mVRMS between 100 Hz and 100 kHz. With the adjunction of the 10 nF capacitor, the wake-up time expands up to 1 ms as shown on the data-sheet curves. If an immediate response is wanted, following figure's circuit gives a solution to charge the bypass capacitor with the enable signal without degrading the noise response of the MC33263. At power-on, C4 is discharged. When the control logic sends its wake-up signal by going to a high level, the PNP base is momentarily tight to ground. The PNP switch closes and immediately charges the bypass capacitor C1 toward its operating value. After a few ms, the PNP opens and becomes totally transparent to the regulator. This circuit improves the response time of the regulator which drops from 1 ms down to 30 ms. The value of C4 needs to be tweaked in order to avoid any bypass capacitor overload during the wake-up transient.
Input Output
6 + C3 1.0 mF 1 On/Off R2 220 k
5
4 +
MC33263
C2 1.0 mF 3
2
C4 470 pF
MMBT2902LT1 Q1
C1 10 nF
Figure 4. A PNP Transistor Drives the Bypass Pin when Enable Goes High
MC33263 Without Wake-up Improvement (Typical Response)
1 ms
MC33263 With Wake-up Improvement (Typical Response) 30 ms
Figure 5. MC33263 Wake-up Improvement with Small PNP Transistor
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MC33263
The PNP being wired upon the bypass pin, it shall not degrade the noise response of the MC33263. Figure 6 confirms the good behavior of the integrated circuit in this area which reaches a typical noise level of 26 mVRMS (100 Hz to 100 kHz) at Iout = 60 mA.
350 300 250 nV/sqrt (Hz) 200 Cbyp = 10 nF 150 100 50 0 100 1,000 10,000 Frequency (Hz) 100,000 1,000,000 Vin = 26 mVrms C = 10 nF @ 100 Hz - 100 kHz Vin = 3.8 V Vout = 2.8 V Co = 1.0 mF Iout = 60 mA Tamb = 25C
Figure 6. Noise Density of the MC33263 with a 10 nF Bypass Capacitor and a Wake-up Improvement Network
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MC33263
TYPICAL PERFORMANCE CHARACTERISTICS
Ground Current Performances
7.0 6.0 GROUND CURRENT (mA) 5.0 4.0 3.0 2.0 1.0 0 0 20 40 60 80 100 120 140 160 180 200 OUTPUT CURRENT (mA) Vin = 3.8 V Vout = 2.8 V CO = 1.0 mF Tamb = 25C 2.1 2.05 GROUND CURRENT (mA) 2.0 1.95 1.9 1.85 1.8 -40
Vin = 3.8 V Vout = 2.8 V CO = 1.0 mF Iout = 60 mA
-20
0
20
40
60
80
AMBIENT TEMPERATURE (C)
Figure 7. Ground Current versus Output Current
Figure 8. Ground Current versus Ambient Temperature
Line Transient Response and Output Voltage
200 QUIESCENT CURRENT ON MODE ( m A) 190 180 170 160 150 140 130 120 110 100 -40 Vin = 3.8 to 7.0 V Y1 = 1.0 mV/div Y2 = 1.0 V/div X = 1.0 ms Iout = 60 mA Tamb = 25C Y1
dVin = 3.2 V
Y2
-20
0
20
40
60
80
100
TEMPERATURE (C)
Figure 9. Quiescent Current versus Temperature
Figure 10. Line Transient Response
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MC33263
TYPICAL PERFORMANCE CHARACTERISTICS
Load Transient Response versus Load Current Slope
Y1 Y2 Vin = 3.8 V Y1 = 100 mV/div Y2 = 20 mV/div X = 200 ms/div Tamb = 25C
Y1
Vin = 3.8 V Y1 = 50 mA/div Y2 = 20 mV/div X = 20 ms Tamb = 25C
Y2
Y1: OUTPUT CURRENT, Y2: OUTPUT VOLTAGE
Y1: OUTPUT CURRENT, Y2: OUTPUT VOLTAGE
Figure 11. Iout = 3.0 mA to 150 mA
Figure 12. ISlope = 100 mA/ms (Large Scale) Iout = 3.0 mA to 150 mA
Y1
Y1
Vin = 3.8 V Y1 = 50 mA/div Y2 = 20 mV/div X = 100 ms Tamb = 25C
Y2
Vin = 3.8 V Y1 = 50 mA/div Y2 = 20 mV/div X = 200 ms Tamb = 25C
Y2
Y1: OUTPUT CURRENT, Y2: OUTPUT VOLTAGE
Y1: OUTPUT CURRENT, Y2: OUTPUT VOLTAGE
Figure 13. ISlope = 6.0 mA/ms (Large Scale) Iout = 3.0 mA to 150 mA
Figure 14. ISlope = 2.0 mA/ms (Large Scale) Iout = 3.0 mA to 150 mA
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MC33263
TYPICAL PERFORMANCE CHARACTERISTICS
Noise Performances
350 300 250 nV/Hz 200 Cbyp = 10 nF 150 100 Vn = 65 mVrms @ C bypass = 0 Vn = 30 mVrms @ Cbypass = 3.3 nF 50 Vn = 25 mVrms @ C bypass = 10 nF over 100 Hz to 100 kHz 0 100 1000 10,000 FREQUENCY (Hz) 3.3 nF 0 nF Vin = 3.8 V Vout = 2.8 V CO = 1.0 mF Iout = 60 mA Tamb = 23C 70 60 RMS NOISE (mV) 50 40 30 20 10 0 100,000 1,000,000 0 Vin = 3.8 V Vout = 2.8 V CO = 1.0 mF Iout = 60 mA Tamb = 25C 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10
BYPASS CAPACITOR (nF)
Figure 15. Noise Density versus Bypass Capacitor
Figure 16. RMS Noise versus Bypass Capacitor (100 Hz - 100 kHz)
Settling Time Performances
1200 1000 SETTLING TIME ( m S) 800 600 400 200 0 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10 BYPASS CAPACITOR (nF) 200 ms/div 500 mV/div Cbyp = 10 nF Vin = 3.8 V Vout = 2.8 V Cout = 1.0 mF Iout = 50 mA Tamb = 25C Vin = 3.8 V Vout = 2.8 V CO = 1.0 mF Iout = 60 mA Tamb = 25C
Figure 17. Output Voltage Settling Time versus Bypass Capacitor
Figure 18. Output Voltage Settling Shape Cbypass = 10 nF
100 ms/div 500 mV/div Cbyp = 3.3 nF
Vin = 3.8 V Vout = 2.8 V Cout = 1.0 mF Iout = 50 mA Tamb = 25C
10 ms/div 500 mV/div Cbyp = 0 nF
Vin = 3.8 V Vout = 2.8 V Cout = 1.0 mF Iout = 50 mA Tamb = 25C
Figure 19. Output Voltage Settling Shape Cbypass = 3.3 nF
Figure 20. Output Voltage Settling Shape without Bypass Capacitor
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MC33263
TYPICAL PERFORMANCE CHARACTERISTICS
Dropout Voltage
250 200 DROPOUT (mV) 150 100 50 0 10 60 IO (mA) 100 150 85C 25C -40C DROPOUT (mV) 150 100 mA 100 50 0 -40 250 200 10 mA 60 mA
150 mA
-20
0
20
40
60
80
100
TEMPERATURE (C)
Figure 21. Dropout Voltage versus Iout
Figure 22. Dropout Voltage versus Temperature
Output Voltage
2.805 2.800 OUTPUT VOLTAGE (V) 2.795 60 mA 2.790 100 mA 2.785 2.780 2.775 2.770 -40 -20 0 20 40 60 80 100 150 mA 1 mA OUTPUT VOLTAGE (V) 2.860 2.840 2.820 2.800 2.780 85C 2.760 2.740 0 20 40 60 80 100 120 140 160 TEMPERATURE (C) OUTPUT CURRENT (mA)
25C
-40C
Figure 23. Output Voltage versus Temperature
Figure 24. Output Voltage versus Iout
Ripple Rejection Performances
0 -10 -20 -30 -40 (dB) -50 -60 -70 -80 -90 -100 100 1000 10,000 100,000 FREQUENCY (Hz) -80 -100 -120 10 100 1000 10,000 100,000 1,000,000 FREQUENCY (Hz) Vin = 3.8 V Vout = 2.8 V CO = 1.0 mF Iout = 60 mA Tamb = 25C (dB) 0 -20 -40 -60 Vin = 3.8 V Vout = 2.8 V CO = 1.0 mF Iout = 60 mA Tamb = 25C
Figure 25. Ripple Rejection versus Frequency with 10 nF Bypass Capacitor
Figure 26. Ripple Rejection versus Frequency without Bypass Capacitor
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MC33263
PACKAGE DIMENSIONS
SOT-23L NW SUFFIX CASE 318J-01 ISSUE B
NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.23 PER SIDE. 4. DIMENSIONS b AND b2 DO NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS OF THE b AND b2 DIMENSIONS AT MAXIMUM MATERIAL CONDITION. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSIONS D AND E1 ARE TO BE DETERMINED AT DATUM PLANE H. MILLIMETERS MIN MAX 1.25 1.40 0.00 0.10 0.35 0.50 0.35 0.45 0.10 0.25 0.10 0.20 3.20 3.60 3.00 3.60 2.00 2.40 0.95 1.90 0.55 0.25 0_ 10_
0.05 E B e
6 5 4 PIN 1 IDENTIFIER IN THIS ZONE S
0.20
M
CB
M
C
1
2 3
A
q
c1 H L
SECTION A-A
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
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EEE CCC EEE
CC CC CC
e1
D
E1
B
A1 A
0.10
A
b
M
CA
A
S
(b) c
b1
DIM A A1 b b1 c c1 D E E1 e e1 L
q
For additional information, please contact your local Sales Representative.
MC33263/D

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